Micron invests $7 billion in HBM assembly facility

Micron invests $7 billion in HBM assembly facility amid AI boom
Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E,
Micron To Build $7 Billion Advanced Chip Facility In Singapore Amid AI Boom
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.
Micron to invest $7B on HBM facility in Singapore
Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.
Singapore slots itself into the HBM supply chain—key to the AI boom—with a $7 billion Micron investment
It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.
Micron breaks ground on new HBM advanced packaging facility in Singapore
Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to its existing facilities in Singapore.
Micron breaks ground on $7B HBM packaging facility in Singapore
Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
Micron’s chip plant to give S’pore foothold in AI space
American tech giant Micron Technology has broken ground for what will be Singapore’s first plant producing advanced ...
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