The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.
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Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in ...
Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...
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