Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

As we get closer to Unpacked – which Samsung still hasn’t officially announced, weirdly – we’re getting more and more details about the upcoming devices. Including a full spec sheet courtesy of ...

Some folks act as if Intel and AMD have killed off the "high-end desktop" or HEDT market, but that's never really been the case. Instead, what happened is that mainstream desktops went from a maximum ...

oHFM FPGA Module Standard is now out as a free, open specification from SGET, aiming to reduce vendor lock-in and speed up FPGA/SoC-FPGA carrier design with a harmonized approach. The oHFM FPGA Module ...

SGET (Standardization Group for Embedded Technologies) has published a new, vendor-independent standard for FPGA and SoC-FPGA modules, aiming to make FPGA designs feel more like the computer-on-module ...

Leaked Galaxy S26 vs S25 spec sheets show steady internal upgrades across the board. The base S26 might feature a larger 6.3-inch display, a bigger 4,300mAh battery, and a shift to the Snapdragon 8 ...

What if the heat you’re trying to manage could become your power source? Thermoelectric generator (TEG) modules make that possible – by turning a temperature difference into an electrical output, with ...

Sprint 1 Add basic login specs/001-basic-login/spec.md Spec describes only "what's new" Sprint 2 Add OAuth specs/002-oauth/spec.md Previous spec doesn't reflect current module state Sprint 3 Add 2FA ...

Melissa Sarnowski has been a game writer for over two years. While she's willing to dig into any game for an article, she heavily focuses on The Legend of Zelda, Resident Evil, Final Fantasy, and The ...