Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: A design methodology for planar loaded antenna arrays is proposed to synthesize a perfect anomalous reflection into an arbitrary direction by optimizing the scattering characteristics of ...
The Chicago Manual of Style is an American English style guide published by the University of Chicago Press. The Manual’s guidelines for publishing, style and usage, and citations and indexes—known as ...
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