Approximate $7 billion investment over the next several years to meet AI data center demandSINGAPORE, Jan. 08, 2025 (GLOBE ...

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Hankook Semiconductor, which holds the world's number one market share in TC bonders, began supplying Micron in April 2024, ...

The US semiconductor giant revealed during its fiscal Q1 2025 earnings call it plans to introduce HBM4 memory products in ...

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.

Micron stock surges after Nvidia CEO praises their chips at CES. But mixed technical signals may impact the rally.

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.