Kyocera Corporation (President: Hideo Tanimoto, hereinafter "Kyocera")(TOKYO:6971) is pleased to announce the development of ...

Acromag has released the QMC730, a multifunction I/O module in the VITA 93 QMC small form factor (26×78.25mm) that combines ...

The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 ...

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced ...

Nvidia introduced the DGX Station at GTC 2026, a desktop supercomputer with 20 petaflops of AI performance and 748GB of coherent memory that can run trillion-parameter AI models locally without the ...

By leveraging the most advanced sixth-generation 10-nanometer (nm)-class DRAM process (1c), Samsung has achieved stable yields and industry-leading performance. The company's next-generation HBM4E, ...

Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the SH603ZA-AP smart module, designed to support a wide range of interfaces for commercial and ...

ACPI's DDR5 RDIMM modules are designed to support the rigorous stability requirements of high-performance workstations and ...

Scalable Edge Performance for Demanding Applications SAN DIEGO, CA, UNITED STATES, March 13, 2026 /EINPresswire.com/ -- ...

Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release ...

Samsung Electronics unveiled its seventh-generation HBM4E chip at Nvidia’s GPU Technology Conference, widely known as GTC, highlighting its push to strengthen i ...

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...