Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Molex Incorporated has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in ...
Sockets provide an interface into the kernel’s networking protocols by allowing programmers to create a communication endpoint in the form of a file descriptor, and by binding a name to the file ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results