Explore the latest advancements in cloud-based mould cooling simulation with Maya HTT and Polygonica. Understand how these technologies optimize injection moulding workflows.

Electromagnetic-thermal co-simulation methods integrate the numerical assessment of electromagnetic fields with thermal analysis to predict the coupled behaviour of systems in which heat generation ...

Researchers introduced AdditiveGDL, a generative deep learning method that predicts local thermal distributions across metal ...

Flotherm 5.1 thermal management simulation software improves handling of complex geometries by letting users create discrete versions of imported CAD models with a grid that reproduces the model's ...

Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

Engineers at MIT have turned one of computing’s biggest headaches, waste heat, into the main act. By sculpting “dust-sized” silicon structures that steer heat as precisely as electrical current, they ...

Version 3.0 of Flomerics'(www.flomerics.com) Flo/PCB thermal simulation software helps solve thermal problems in solder reflow processing associated with the use of lead-free solders. In particular, ...

A new technical paper titled “A Thermal Machine Learning Solver For Chip Simulation” was published by researchers at Ansys. “Thermal analysis provides deeper insights into electronic chips’ behavior ...

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various ...

Malvern, Pa., USA: A novel Webbased tool gives designers a detailed simulation of how Vishay Siliconix MOSFETs will perform thermally, and how they will be affected by adjacent components in a range ...