MarketWatch

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

-- Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach. -- The study allows to identify and mitigate thermal ...
Hosted on MSN

Imec pushes 3D HBM-on-GPU technology to extreme limits

3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced ...
Semiconductor Engineering

STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)

A new technical paper titled “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by researchers at imec, INESC-ID, Université ...
Barchart on MSN

Why Wall Street Loves Cadence Design Systems Stock Here

Shares of electronic design automation Cadence Design Systems (CDNS) found themselves back in the spotlight on June 8 after the company announced an expanded partnership with Intel (INTW) Foundry that ...
KVOA 4

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures Imec ...
Missoulian

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures ...