EDN

3D EM simulator suits RF module design

The EMDS-for-ADS full 3D electromagnetic (EM) simulator is integrated into Advanced Design System update 2 EDA software platform and eliminates the need for stand-alone EM tools. The tool helps ...
Design-Reuse

Introducing Cadence's Virtuoso Studio RF: Advancing RF Design for 3D-IC

Next-generation RF to millimeter-wave silicon MMIC and module product development software Cadence is excited to announce the launch of its latest RF design and analysis platform, Virtuoso Studio RF.
Business Wire

Heptagon Announces Acquisition of RF Digital Corporation

SANTA CLARA, Calif.--(BUSINESS WIRE)--Heptagon (www.hptg.com), an industry leader in sensing, illumination and 3D imaging solutions for the Internet of Things (IoT) and Smart Devices, today announced ...
Dataquest

Joint work shows next generations of RF and optical front-end modules (FEM)

CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing the key enablers for a new high-performance and versatile RF Si platform co-integrating best-in-class active and passive ...
DC Velocity

Avnet Launches XRF16-Gen 3 System-on-Module for Multi-Channel RF Applications

New production-ready 16x16 direct-RF sampling module with 6 GHz analog bandwidth features the highly successful Xilinx UltraScale+ RFSoC Gen3 device DC Velocity Staff ...
Electronic Design

Module Integrates 3D Time-of-Flight Sensor

In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module. The module is built into a custom, handheld capture system. The ADTF3175 chip has 1k × 1k ...
Design-Reuse

CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration

Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of ...