Electronic Design

UHV SiC Devices Geared Toward Mission-Critical Energy Infrastructure Apps

The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...
Electronic Design

New Power Module Integrates SiC MOSFETs and IGBTs to Cut EV Costs

Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...
pv magazine International

Onsemi launches silicon carbide power integrated modules for utility-scale PV

Onsemi has released an upgraded series of power modules to boost utility-scale solar generation and storage. The new line consists of silicon and silicon carbide hybrid power-integrated modules (PIMs) ...
Semiconductor Engineering

Integration Of S-Parameters For Power Module Verification Into The Engineers’ Design Environment

Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...
Nasdaq

Navitas Semiconductor Launches New SiCPAK™ Power Modules with Advanced Epoxy-Resin Technology for High-Power Applications

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
EurekAlert!

A novel package for high power density SIC power modules

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...