When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical ...

\[July 28, 2006\] Measuring 2.8 mm × 5.7 mm and weighing a slight 0.2g, the Model 352C23 ICP accelerometer embarks as a viable component for measuring shock and vibration in space-restricted locations ...

Pulsonix, the industry-leading PCB design software from WestDev Ltd, has announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal ...

Is your PCB design team spending too much time waiting for IR-drop analysis results on the power delivery network (PDN), or trying to optimize the decoupling capacitor network without under- or ...

Thermal analysis is the process of measuring how a material/device behaves at different temperatures. For many applications, especially single materials, a thermal analysis is a physical analytical ...

Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness.

The causal agent of Class II MLCC acoustic noise. What are the main elements that contribute to the noise problem? A “specialized” option to acquiring a low acoustic noise MLCC. System speeds across ...

This article explains how adhesives and sealants improve connector reliability through moisture barriers, vibration damping, and mechanical stabilization.