Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...

BEIJING (Reuters) -SiCarrier, a Chinese chip equipment maker with close links to Huawei, has created a stir with the breadth of its planned product range. Its efforts to become a one-stop shop for all ...

Rapidus Corp., a Tokyo-based chip manufacturing startup, reportedly plans to build a fab capable of making 1.4-nanometer processors. Nikkei Asia reported the initiative today. The fab could create ...

Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...

The MarketWatch News Department was not involved in the creation of this content. Wafer Defect Inspection System Market to Reach USD 14.43 Billion by 2031 on Rising Advanced Chip Manufacturing | ...