A new technical paper titled “Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization” was published by researchers at Corintis. “The continuous increase in ...
The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...
Microsoft Unveils Microfluidic Cooling Breakthrough to Tame Overheating AI Chips Your email has been sent AI’s heat problem may have met its match. Microsoft says it has successfully tested a ...
Data center rack density has risen rapidly in recent years. Operators are cramming more computing power into each server rack to meet the needs of AI and other high-performance computing applications.
Microsoft engineers have devised a new way to keep data centers cool — and it might help prevent the next generation of artificial intelligence (AI) hardware from cooking itself to death. The ...
The channels in Microsoft’s new microfluidics design match the heat signatures of chips, resembling the veins of a plant. (Microsoft Photo) REDMOND, Wash. — About 5 minutes before each hour, and 5 ...