TE’s new Sliver straddle-mount connectors to be useful for OCP NIC 3.0 cards in a low profile for ease of system maintenance and improved thermal management. TE Connectivity (TE) recently introduced ...
This article outlines the system requirements for the Open Compute Project (OCP) Open Rack V3 (ORV3) battery backup unit (BBU). It emphasizes the importance of having an efficient and intelligent BBU ...
Toshiba Semiconductor Company decided to widely adopt OCP as the host interface for in-house IP cores. OCP, which is standardized by OCP-IP, is the specification standard host interface for these ...
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