EDN

New CMP process for sub-100nm copper and low-k wafers

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
EDN

NuTool debuts speedy CMP for copper

MILPITAS, Calif. — NuTool Inc. has introduced a chemical mechanical polishing process using a fixed abrasive that is intended for polishing copper on ultra low-k (ULK) dielectrics with a k value of ...
Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
AZOM

Using White Light Interferometry to Characterize CMP Processes

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...