Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Oregon-based TDA Systems has developed a time domain reflectometry (TDR) system to pinpoint faults in ball grid array (BGA) packages. With support from the International Sematech Assembly Analytical ...

Featuring power ratings from 0.5W (0865 ball grid package) to 1.6W (1065 ball grid package), the CHC series of termination arrays are suited for use in portable products and high-speed switches that ...

Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...