Looking forward, we are nearing the end of the 2D screen. As holographic light field technology matures, we will see a ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Discover the future of energy with a 3D printed battery that maximizes storage and efficiency, transforming various ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...