Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

TL;DR: Huawei is set to lead Apple by integrating high-performance HBM DRAM with 3D stacking technology in smartphones, boosting AI efficiency and bandwidth while reducing chip size. Apple plans to ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

NEW HAVEN, Conn. (WTNH) — High tech is making its mark when it comes to procedures like replacing a knee. 3D technology is guiding more surgeons to provide personalized joint replacement treatment.

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron. According to reports from TheElec and ZDNet Korea, citing industry sources, ...

Tech Soft 3D, a provider of engineering software development toolkits (SDKs) for engineering software, recently acquired Actify's core business, including CAD viewer and collaboration tool SpinFire.

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Generative AI is transforming the technology landscape, introducing new large language models (LLMs), development tools and a range of new or enhanced applications. As adoption grows, organizations ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more In mere months, the generative AI ...